发明名称 |
Method and structures for indexing dice |
摘要 |
A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.
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申请公布号 |
US7491620(B2) |
申请公布日期 |
2009.02.17 |
申请号 |
US20080070583 |
申请日期 |
2008.02.19 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
BRAMBILLA DANIELE ALFREDO;VALTOLINA MARCO NATALE |
分类号 |
H01L21/76;G01R31/26;H01L23/544 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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