| 摘要 |
A prober and a method for reducing errors in the contact position between a probe and an electrode without lowering throughput when conducting a test of a wafer at a high or low temperature. The prober includes a wafer chuck for holding a wafer, a movement mechanism for moving the wafer chuck, a temperature adjustment mechanism for adjusting the temperature of the wafer chuck to maintain the wafer at a predetermined temperature, an alignment mechanism for measuring a positional relationship between the electrode of the device of the wafer and the probe, a movement control section for calculating the amount of movement to touch the electrode to the probe based on the positional relationship between the electrode and the probe measured by the alignment mechanism and controlling the movement mechanism based on the calculated amount of movement and a wafer temperature sensor that detects the temperature of the wafer before it is held on the wafer chuck.
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