Method and apparatus for providing thermal management on high-power integrated circuit devices

摘要

An apparatus for providing thermal management on high-power integrated circuit devices is disclosed. Initially, contacts to active devices are formed. Phase change materials are then applied over potential hot spots that can be formed by the active devices. A layer of high-thermally conductive materials is deposited over the phase change materials. The layer of high-thermally conductive materials and the phase change materials are subsequently etched according to a pattern. A layer of passivation conductive vias is subsequently applied to the phase change materials to complete the formation of phase change heatsinks.