| 摘要 |
A supporting plate for slicing a silicon ingot is provided to reduce a consumed amount of a support material by reducing an error and a resistance to a slicing device. A support includes a fixing unit(2) protruded from both sides of a curved surface(1) and the curved surface contacting the silicon ingot. The fixing unit is formed with the step with an end part(12) of the curved surface. The lowermost part(11) of the curved surface is formed in the location higher than the uppermost part(21) of the fixing unit.
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