发明名称 |
Method of manufacturing electro-optical device |
摘要 |
There is provided a method of manufacturing an electro-optical device from a large substrate that is cut into a plurality of first substrates having a chip shape. In the electro-optical device, second substrates of a chip shape are bonded to the first substrates. The method includes adhering a large glass substrate to approximately an entire surface of the large substrate opposite to a surface to which the second substrates are bonded; and cutting both the large substrate and the large glass substrate into first substrate units.
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申请公布号 |
US7491580(B2) |
申请公布日期 |
2009.02.17 |
申请号 |
US20050131235 |
申请日期 |
2005.05.18 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
MATSUSHIMA SEIICHI;MURAKAMI KENJI;MARUYAMA HIROKI |
分类号 |
H01L21/461;G02F1/13;G02F1/1333;G02F1/1335;G09F9/00;H01L21/77;H01L21/84;H01L27/12 |
主分类号 |
H01L21/461 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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