PACKAGING METHOD AND PACKAGE THEREOF MICRO ELECTRO MECHANICAL SYSTEMS DEVICES

摘要

A packaging method of an electro mechanical system device and the packaging are provided to minimize chemical damage in the micro electro mechanical system device by reducing a removal time of a sacrificial layer. A sacrificial layer(315) is deposited on a substrate with a micro electro mechanical system device(350). A porous oxidation coating layer(320) is formed in an upper part the sacrificial layer. The inner part of the sacrificial layer is etched through a plurality of pores formed in the porous oxidation coating layer. A shielding layer(323) is formed on the etched sacrificial layer.