AKTOR MIT REDUZIERTER ANTRIEBSKAPAZITÄT

摘要

Techniques are provided for reducing the amount of power required to activate a piezoelectric actuator of a microelectromechanical structure. An insulating layer is deposited on a piezoelectric layer. The insulating layer is etched to remove a portion of the layer and expose the piezoelectric layer in the etched areas. An electrode layer is deposited on the piezoelectric layer and insulating layer.