OPTICAL-ELECTRICAL PRINTED CIRCUIT MODULE AND OPTICAL-ELECTRICAL SIMULTANEOUS COMMUNICATION SYSTEM COMPRISING THE SAME MODULE

摘要

An optical-electrical printed circuit module and an optical-electrical simultaneous communication system comprising the same are provided to improve optical coupling efficiency degradation generated in a flip-chip bonding process. A substrate(10) is formed. An optical waveguide(24) layer including an optical waveguide formed on the substrate is formed. An optical bench(50) is formed on the optical waveguide layer. A first electrical wire is formed in the lower surface of the optical bench and a concave part exposing the first electrical wire is formed in the optical bench. A photoelectric semiconductor chip part(40) comprises: an intermediation main body; a convex part formed in the lower surface of the intermediation main body in order to be inserted into the concave part; a photoelectric device(44) positioned in the lower surface of the intermediation main body; and a second electric wire connected from extrusion floor side of the convex part to the photoelectric device. A photoelectric device drive(30) is arranged to the optical waveguide layer or the upper part of the photoelectric semiconductor chip part and operates a photoelectric device.