LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE CHIP

摘要

A light emitting diode package and a light emitting diode chip are provided to improve optical characteristic by reducing the chromatic aberration by emitting the light through an upper part of a molding part with uniformly distributed fluorescent substance. A light-emitting diode package includes a first lead(110), a second lead(120), a body(130), a molding part(140) and a light emitting diode chip(200). The first and second leads are connected to external electrodes. The body is integrated with the first and second leads and the light emitting diode chip is mounted on the body. The molding part seals the light emitting diode chip in an upper part of the body and includes a fluorescent substance(180). The light emitting diode chip includes a substrate, and a semiconductor layer formed on the substrate. The outer surface of the substrate is coated with the reflective material. The substrate is a sapphire substrate. Ti or Cr metal layer is formed between the sapphire substrate and the metal reflective material for coupling the sapphire substrate and the metal reflective material.