发明名称 |
Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi |
摘要 |
The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern. |
申请公布号 |
FI119714(B) |
申请公布日期 |
2009.02.13 |
申请号 |
FI20050000646 |
申请日期 |
2005.06.16 |
申请人 |
IMBERA ELECTRONICS OY, |
发明人 |
TUOMINEN,RISTO;IIHOLA,ANTTI;PALM,PETTERI |
分类号 |
H05K3/10;H01L21/48;H01L21/60;H01L23/13;H01L23/538;H01L23/544;H05K;H05K1/18;H05K3/20;H05K3/28;H05K3/30;H05K3/32;H05K3/40 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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