| 摘要 |
A substrate heating apparatus of the present invention, which heats a substrate mounted on a mount table 104 having heating means 108, in a processing vessel 102, includes a supporting part 202 made from a first material to support the mount table, a sealing part 204 made from a second material different from the first material in heat conductivity to seal the supporting part and the processing vessel and a joint part 206 for joining the supporting part and the sealing part in an airtight manner. With the constitution, by selecting the first material and the second material of different heat conductivities properly, it is possible to reduce a heat gradient between the top of the mount table and the bottom of the mount table. As a result, it is possible to shorten a supporting structure for the mount table, in length. <IMAGE> |
