TIN OXIDE POWDER FOR ITO SPUTTERING TARGET, PRODUCTION METHOD OF THE POWDER, SINTERED BODY SPUTTERING TARGET FOR ITO FILM FORMATION AND PRODUCTION METHOD OF THE TARGET

摘要

PROBLEM TO BE SOLVED: To provide a tin oxide powder that can give a sintered body having excellent density enhancing feature and component uniformity suitable for ITO thin film formation, to provide a sputtering target for ITO film formation, the target sintered by using the powder, and to provide an inexpensive tin oxide-indium oxide target for ITO film formation, the target that can suppress nodules from being generated in ITO thin film formation and suppress associated degradation in the thin film quality.

SOLUTION: The tin oxide powder for an ITO sputtering target is characterized in that a median diameter obtained from a particle size distribution ranges from 0.40 to 1.0 μm and that a 90%-particle size obtained from a particle size distribution is up to 3.0 μm.

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