| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive film for connecting an electronic component which is improved in the connection reliability. <P>SOLUTION: The adhesive film 10 has the first and the second adhesive layers 11, 12 and conductive particles 15 dispersed in the first adhesive layer 11. The first and the second adhesive layers 11, 12 contain the first and the second main resin components, the glass transition temperature of the first main resin component is higher than the reaction peak temperature of the first and the second adhesive layers 11, 12, and the glass transition temperature of the second main resin component is lower than the glass transition temperature of the first main resin component and lower than the reaction peak temperature of the first and the second adhesive layers 11, 12. <P>COPYRIGHT: (C)2009,JPO&INPIT |
