| 摘要 |
<P>PROBLEM TO BE SOLVED: To effectively utilize a plasma generation gas. <P>SOLUTION: The plasma treatment device directly supplies the plasma generation gas on the surface of a treating object 2 through a plurality of through holes 6 that are formed on an electrode substrate 4. Thereby, by supplying the plasma generation gas by an amount only necessary for surface treatment of the treating object 2, the plasma generation gas is effectively utilized and consumption amount of the plasma generation gas can be reduced. <P>COPYRIGHT: (C)2009,JPO&INPIT |
