发明名称 HEAT SINK FOR MOTOR DRIVE CIRCUIT
摘要 PROBLEM TO BE SOLVED: To prevent characteristics of temperature rise from being defferent due to non-uniform heat values in respective circuits. SOLUTION: When multiple axes are controlled by one control board, surface mount devices having the same shape are employed as the multiple output semiconductor devices used in motor driving circuits to be arranged on the same surface and a single aluminum heat sink is fixed so as be in contact with the semiconductor devices. The surface temperatures of the respective devices are uniformed, thereby uniforming the temperatures of the peripheral components. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009033916(A) 申请公布日期 2009.02.12
申请号 JP20070197186 申请日期 2007.07.30
申请人 NIDEC SERVO CORP 发明人 OKABE TOSHIHIRO
分类号 H02M1/00;H01L23/40 主分类号 H02M1/00
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