发明名称 PACKAGE-ON-PACKAGE TYPE ELECTRONIC COMPONENT, ITS INSPECTION TOOL, AND ITS INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a package-on-package type electronic component and its inspection method. SOLUTION: This inspection method of the package-on-package type electronic component 1 for laminating electrically connectably and inspecting a plurality of packages 14, 15 having electric connection terminals 12, 13 is described as follows: an inspection tool 2 having an inspection tool body 26 for positioning and holding the side face of the package-on-package type electronic component 1 is installed over a printed board 18; a mounting socket 19 is laminated and held on the lowermost layer of the inspection tool 2; the package 14 is laminated; a socket 16 for a stuck is laminated between the packages 14, 15; the package 15 is laminated on the uppermost layer; a stopper 22 for preventing upward movement of the package 15 on the uppermost layer is allowed to wait over the package; the printed board 18 is moved upward; the package-on-package type electronic component 1 is sandwiched between the printed board 18 and the stopper 22, to thereby electrically inspect the plurality of packages. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009030978(A) 申请公布日期 2009.02.12
申请号 JP20070191900 申请日期 2007.07.24
申请人 ADVANCED SYSTEMS JAPAN INC 发明人 HIRAI YUKIHIRO
分类号 G01R1/073 主分类号 G01R1/073
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