| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing semiconductors that can be ejected in a liquid state in a sealing operation, gives a cured product exhibiting good reflow resistance at a high temperature and good moisture resistance reliability, and permits the manufacture by resin-sealing therewith of a semiconductor element as a sealed article hardly suffering from warpage, which is an important performance in an after-process. SOLUTION: The resin composition for sealing semiconductors comprises as essential ingredients (A) an epoxy resin comprising a biphenyl type liquid epoxy resin, (B) a curing agent bearing at least two phenolic hydroxy groups for epoxy resins, (C) a curing catalyst for epoxy resins and (D) an inorganic filler, where the resin composition can be liquefied at 40-80°C and can ejected in a liquid state and thus is suitable for sealing semiconductors. COPYRIGHT: (C)2009,JPO&INPIT
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