Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method

摘要

A polishing method configured to simultaneously polish both surfaces of a work includes the steps of inserting the work into a hole in a carrier and fixing the work with a fixing member, attaching the carrier to a polishing apparatus, polishing both surfaces of the work simultaneously, and detaching the carrier from the polishing apparatus after the polishing step, and attaching the carrier to an immediate cleaning apparatus.