发明名称 |
SEALING STRUCTURE OF TERMINAL AND SEALING MATERIAL THEREFOR |
摘要 |
The present invention intends to provide a sealing structure of a terminal that is low in a processing temperature for sealing, easy in sealing operation and high in the productivity. In the invention, the thermal expansion coefficient of a sealing material is made equivalent to or more than the linear expansion coefficient of a metallic sealing case block by adding inorganic filler to a liquid thermosetting polymer.
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申请公布号 |
US2009039545(A1) |
申请公布日期 |
2009.02.12 |
申请号 |
US20080248718 |
申请日期 |
2008.10.09 |
申请人 |
OMRON CORPORATION |
发明人 |
HAYASE TETSUO;SAKAMOTO ICHIZO;NISHIDA TAKESHI;WATANABE YUJI;YOSHIKAWA TORU |
分类号 |
B29C65/40;C09K3/10;H01H9/04;H01H45/02;H01H50/02;H01H50/14 |
主分类号 |
B29C65/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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