发明名称 SEALING STRUCTURE OF TERMINAL AND SEALING MATERIAL THEREFOR
摘要 The present invention intends to provide a sealing structure of a terminal that is low in a processing temperature for sealing, easy in sealing operation and high in the productivity. In the invention, the thermal expansion coefficient of a sealing material is made equivalent to or more than the linear expansion coefficient of a metallic sealing case block by adding inorganic filler to a liquid thermosetting polymer.
申请公布号 US2009039545(A1) 申请公布日期 2009.02.12
申请号 US20080248718 申请日期 2008.10.09
申请人 OMRON CORPORATION 发明人 HAYASE TETSUO;SAKAMOTO ICHIZO;NISHIDA TAKESHI;WATANABE YUJI;YOSHIKAWA TORU
分类号 B29C65/40;C09K3/10;H01H9/04;H01H45/02;H01H50/02;H01H50/14 主分类号 B29C65/40
代理机构 代理人
主权项
地址