发明名称 Multilayered printed circuit board and manufacturing method thereof
摘要 A multilayered printed circuit board is disclosed. A method of manufacturing the multilayered printed circuit board, which includes: forming a metal layer and a lower-circuit-forming pattern in order on a carrier, and forming a lower circuit by filling a conductive material in the lower-circuit-forming pattern; removing the lower-circuit-forming pattern, stacking an insulation resin, and forming at least one via hole connecting with the lower circuit; forming at least one inner circuit and at least one interlayer connector connecting the inner circuit with the lower circuit on the insulation resin, to form a pair of circuit parts; and aligning the pair of circuit parts, attaching the pair of circuit parts to each other, and removing the carrier and the metal layer, allows the forming of fine-lined circuits and provides a thin board, while preventing bending and warpage in the board.
申请公布号 US2009038837(A1) 申请公布日期 2009.02.12
申请号 US20080078176 申请日期 2008.03.27
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 OKABE SHUHICHI;AN JIN-YONG;LEE SEOK-KYU;JUNG SOON-OH;HONG JONG-KUK;SEO HAE-NAM
分类号 H05K1/11;B32B38/10 主分类号 H05K1/11
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