| 摘要 |
The invention relates to a method for soldering a first element (1) to a second element (2), a solder (5) being applied in the zone of junction (3), the junction being produced in at least one zone of junction (3). According to the invention, the first element (1) is only heated in a heating zone (4), said heating (4) being different from the zone of junction (3), and the first element (1) being heated in such a manner that the first element (1) has a temperature above the melting point of the solder (5) in at least one melting zone (6). The invention also relates to a field device of process and automation engineering that is produced according to this method. |
