发明名称 |
METHOD OF SEGMENTING SEMICONDUCTOR WAFER |
摘要 |
To provide a method of segmenting a semiconductor wafer, which is capable of preventing chippings. A semiconductor wafer 1 is partitioned into a circumferential ring-shaped region 1a and a segmentation region placed in the inner side of the ring-shaped region 1a. The semiconductor wafer 1 included in the segmentation region is cut into the form of a lattice along a plurality of perpendicular cutting lines 4 and is segmented into a plurality of chips 2. On the other hand, the semiconductor wafer 1 included in the ring-shaped region 1a is cut along two partition lines 5 extending in parallel to the cutting lines 4 from the center O of the semiconductor wafer 1 and is partitioned into four independent regions. |
申请公布号 |
WO2009020245(A2) |
申请公布日期 |
2009.02.12 |
申请号 |
WO2008JP64567 |
申请日期 |
2008.08.07 |
申请人 |
PANASONIC CORPORATION;ARITA, KIYOSHI;HARIKAI, ATSUSHI |
发明人 |
ARITA, KIYOSHI;HARIKAI, ATSUSHI |
分类号 |
H01L21/78;H01L21/683 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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