| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a packaging technology for a thermocompression bonding device having a simple constitution, wherein electrical components can be packaged efficiently, using an adhesive. <P>SOLUTION: The thermocompression bonding device is provided with a stage 2 of rigid material, a compression-bonding member 3 of elastic material which is attached to the stage 2, and a heating mechanism 4 which is arranged above the compression-bonding member 3 to face each other, being movable in the vertical direction. At a main part 40 of the heating mechanism 4, a heating pressurizing surface 40a whose size corresponds to a heating region for the adhesive used for thermocompression bonding is formed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
