| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board in which a mother-board has enhanced thermal conductivity. <P>SOLUTION: The circuit board is obtained by forming a conductive layer on a mother-board formed of a silicon nitride-based sintered compact, and the board contains Li in an amount of 0.009-0.046 mass% based on the total amount. The mother-board of the circuit board is manufactured by forming a mixed powder obtained by adding an Li compound, to a silicon nitride powder, in an amount of 0.3-1.5 mass%, expressed in terms of Li<SB>2</SB>O, based on the total amount and then firing the resulting formed body so that the Li content becomes 0.009-0.46 mass% based on the total amount. <P>COPYRIGHT: (C)2009,JPO&INPIT |
