| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a fin-integrated semiconductor module having high quality wherein crack and breakage of a substrate and a mounting member, etc. caused by stress at manufacturing and heat history at driving, etc. are prevented. <P>SOLUTION: This module includes a substrate 11 which is made of metal or ceramics and has groove 11a on its one surface side surface and a circuit pattern 15 formed on another surface side surface, a semiconductor chip 19 mounted on the circuit pattern via a solder 25, and a mold member 21 made of epoxy resin which is so provided as to cover another surface side surface of the substrate including the semiconductor chip. A heat radiating fin 23 is engaged in the groove of the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
