| 摘要 |
Via multiplexing technology is provided which can contribute to high density wiring. For coupling wirings of different wiring layers, a multiple via cell section is used which has vias for electrically coupling wirings bent in an L-shape of different wiring layers on both sides with the L-shaped bent portion therebetween. The vias of the multiple via cell section are on a grid line in an X-direction and a grid line in a Y-direction defined with a minimum wiring pitch, and all or part of the vias of the multiple via cell section are deviated from an intersection of the grid line in the X-direction and the grid line in the Y-direction. The vias of the multiple via cell section are placed on each of the grid line in the X-direction and the grid line in the Y-direction, corresponding to the L-shape, so that there is not much difference between the spatial conditions in the X-direction and the spatial conditions in the Y-direction viewed from the multiple via cell section. Thus, the wirability in the X-direction becomes equivalent to that in the Y-direction.
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