CHIP FUSE AND ITS MANUFACTURING METHOD

摘要

A chip fuse which is suppressed in temperature rise in steady operation in a high rated current region, has time lag type fusion characteristics, and has a high yield, and its manufacturing method, are provided. In the chip fuse, a heat storage layer (12) is formed on an insulation substrate (11), and a fuse film (13) is formed on the heat storage layer (12) so as not to be in contact with the insulation substrate (11). The fuse film (13) consists of front electrode portions (13a) disposed on both sides and a fuse element portion (13b) formed between the front electrode portions (13a). A protection layer (15) made of a material having a thermal conductivity higher than that of the heat storage layer (12) is formed between the front electrode portions (13a), covering the fuse element portion (13b). By forming the heat storage layer (12) in such a size not as to cover the whole area (11a) wherein the fuse element portion (13b) is to be formed, the protection layer (15) is partially brought into contact with the insulation substrate.