发明名称 APPARATUS AND METHOD FOR PLASMA DOPING
摘要 Gas supplied to gas flow passages of a top plate from a gas supply device by gas supply lines forms flow along a vertical direction along a central axis of a substrate, so that the gas blown from gas blow holes can be made to be uniform, and a sheet resistance distribution is rotationally symmetric around a substrate center.
申请公布号 US2009042321(A1) 申请公布日期 2009.02.12
申请号 US20080183775 申请日期 2008.07.31
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SASAKI YUICHIRO;OKUMURA TOMOHIRO;ITO HIROYUKI;NAKAMOTO KEIICHI;OKASHITA KATSUMI;MIZUNO BUNJI
分类号 H01L21/66;C23C16/513 主分类号 H01L21/66
代理机构 代理人
主权项
地址