| 摘要 |
A semiconductor device includes a semiconductor constituent provided with a semiconductor substrate and a plurality of electrodes for external connection (13) provided under the semiconductor substrate. A lower-layer insulating film (1) is provided under and around the semiconductor constituent. A plurality of lower-layer wirings (22, 22A) are electrically connected to the electrodes for external connection of the semiconductor constituent, and provided under the lower-layer insulating film. An insulation layer (31) is provided on the lower-layer insulating film in the periphery of the semiconductor constituent. An upper-layer insulating film (32) is provided on the semiconductor constituent and the insulation layer. A plurality of upper-layer wirings (33, 33A) are provided on the upper-layer insulating film. A base plate (51) on which the semiconductor constituent and the insulation layer are mounted is removed. |
