| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an arranging apparatus and an arrangement method, which can arrange minute magnetic solder balls on a connection pad of a substrate without damaging and deforming the solder balls and without mixing any foreign matters. <P>SOLUTION: The apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate; a magnet that is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate to cause magnetic force to act on an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using the arranging apparatus is also provided. Further, an apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate; a mask frame capable of being positioned above the stage; and a magnetic force generator that is movable above the mask frame and causes magnetic force to act on the stage. An arranging method using the arranging apparatus is also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT |
