| 摘要 |
PROBLEM TO BE SOLVED: To provide a fly cutter grinding device capable of effectively grinding a metallic layer which is a plated layer prepared by plating a semiconductor wafer in a process for manufacturing at least one of MEMS devices with copper without causing clogging not like a conventional cup wheel diamond grinding tool. SOLUTION: This device is provided with the semiconductor wafer W chucked by a chuck plate 4 so as to be ground, and a fly cutter blade 10 on the lower surface of a fly cutter plate 9. An air bearing 11 is interposed between a spindle casing 7 and a spindle shaft 8, and the fly cutter blade 10 is annularly provided along the outer periphery of the fly cutter plate 9, and the metallic layer formed in the process for manufacturing at least one of MEMS devices with the semiconductor wafer W is ground. COPYRIGHT: (C)2009,JPO&INPIT
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