发明名称 MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a second electrode including a second metal and opposing the first electrode, the second electrode configured to be charged by a positive charge. A dielectric layer is interposed between the first electrode and second electrode, and an ionization tendency of the first metal is larger than and ionization tendency of the second metal.
申请公布号 US2009038835(A1) 申请公布日期 2009.02.12
申请号 US20080186604 申请日期 2008.08.06
申请人 IBIDEN CO., LTD 发明人 TANAKA HIRONORI;SHIMIZU KEISUKE
分类号 H05K3/30;H05K1/16 主分类号 H05K3/30
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