| 摘要 |
Disclosed herein are a heat dissipating device for memory modules and a method of manufacturing the same. The heat dissipating device is configured such that heat sinks are respectively bonded to front and rear surfaces of the memory module using bonding means, each having a heat conduction characteristic. The method includes preparing liquid adhesive having a heat conduction characteristic, directly applying the liquid adhesive to portions of the heat sink that comes into contact with the respective memory modules, and curing the liquid adhesive. The bonding means is formed through the steps, and the liquid adhesive is formed by adding both heat conducting filler and curing agent to silicone. |
