| 发明名称 |
Semiconductor device with semiconductor chip and method for producing it |
| 摘要 |
A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts. |
| 申请公布号 |
US2009039484(A1) |
申请公布日期 |
2009.02.12 |
| 申请号 |
US20070834262 |
申请日期 |
2007.08.06 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
MAHLER JOACHIM;HAIMERL ALFRED;KESSLER ANGELA;BAUER MICHAEL;SCHOBER WOLFGANG |
| 分类号 |
H01L23/495;H01L21/60 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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