SEMICONDUCTOR PLASTIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor plastic package excellent in connection reliability between a semiconductor chip and a circuit board, and its manufacturing method.

SOLUTION: This semiconductor plastic package is formed with steps of: providing a core substrate which is provided with a pad and has a thermal expansion coefficient of 9 ppm/°C or less; laminating a build-up insulating layer on the core substrate; removing the build-up insulating layer to form an opening so as to expose the pad outward; and mounting the semiconductor chip in the opening to electrically connect the semiconductor chip and the pad.

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