MANUFACTURING METHOD OF SOLID-STATE IMAGING DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem that when there are any protrusion and recessed portion at an opening part of a casing, it is difficult to block the opening part with a protective film so that foreign matter such as dust can not enter the opening part at the time of substrate dividing.

SOLUTION: The manufacturing method of a solid-state imaging device includes: a process of mounting a plurality of solid state imaging elements 1 and casings 3 on an assembly substrate 2 where a plurality of wiring substrates are arranged in a matrix; a process of mounting a reception member having a substantially cylindrical protruded portions engaging an opening end of a substantially cylindrical optical member support part of the plurality of the casing mounted on the assembly substrate; and a substrate dividing process of dividing the assembly substrate in a state where the receiving member is mounted.

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