| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power semiconductor module having a closed mechanism for a substrate carrier, and to provide a method of manufacturing the same. <P>SOLUTION: The power semiconductor module has a casing made of first plastic and at least one substrate carrier. The substrate carrier has a circuit configuration formed on the substrate carrier, and an electric coupling element extended from the circuit configuration. The casing has a fixing means for permanent connection to the substrate carrier, and a permanently elastic sealing mechanism that is integrated with the casing, is extended annularly, is opposite to the first inner main surface of the substrate carrier, and is made of second plastic. The method has: a step for forming the casing from first mechanically stable plastic and for forming the sealing mechanism from second permanently elastic plastic; a step for arranging at least one substrate carrier in the casing; and a step for forming the permanent connection between the casing and the substrate carrier by the fixing means. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
