| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayered circuit board that achieves sure electrical connection between respective layers. <P>SOLUTION: The multilayered circuit board has the following configuration. A circuit board 14 is configured so that an electric circuit 17 is formed on one face of a wafer 16 and each via-hole 19, penetrating in between the surface and the rear face is drilled. A plurality of the circuit boards are stacked so as to be multilayered. Each via-hole 19 drilled in each circuit board is made to communicate with each other among a plurality of the multilayered layers. A conductive liquid viscous material 4 is filled into each via-hole 19 made to communicate with each other. Consequently, each circuit board 14 is electrically connected to each other. The diameter of a communication part 21a, on the side where the electric circuit 17 is formed, of the via-hole 19 or that of a communication part 21b on the side opposite to it, is formed larger than a diameter of a halfway part of the via-hole 19. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
