发明名称 SUBSTRATE SUPPORTING APPARATUS
摘要 A substrate supporting apparatus includes first and second shafts spaced by a distance that corresponds to or exceeds a width of a substrate, and at least one wire to support the substrate. The wire has ends coupled to respective ones of the first and second shafts. The wire is raised and lowered to place a substrate onto a lower electrode in a substrate processing chamber and to remove the substrate when processing is completed.
申请公布号 US2009042324(A1) 申请公布日期 2009.02.12
申请号 US20080188453 申请日期 2008.08.08
申请人 SON SUK MIN 发明人 SON SUK MIN
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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