发明名称 |
Backside Rapid Thermal Processing of Patterned Wafers |
摘要 |
Apparatus and methods of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP) apparatus and methods are disclosed. An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer. In one or more embodiments, the front side of the wafer on which the patterned integrated circuits are being formed faces a radiant reflector. In one or more embodiments, the wafer is thermally monitored for temperature and reflectivity from the side of the reflector.
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申请公布号 |
US2009041443(A1) |
申请公布日期 |
2009.02.12 |
申请号 |
US20080193439 |
申请日期 |
2008.08.18 |
申请人 |
ADERHOLD WOLFGANG;RAMAMURTHY SUNDAR;HUNTER AARON |
发明人 |
ADERHOLD WOLFGANG;RAMAMURTHY SUNDAR;HUNTER AARON |
分类号 |
F26B19/00;F27B5/14;F27B17/00;F27D11/00;F27D19/00;F27D21/00;H01L21/00 |
主分类号 |
F26B19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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