发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition excellent in sensitivity and resolution. <P>SOLUTION: The positive photosensitive resin composition comprises (A) 100 parts by mass of a polymer which is an alkali-soluble phenolic resin, polyhydroxystyrene or polyhydroxystyrene derivative, (B) 1-50 parts by mass of a photoacid generator, and (C) 0.01-70 parts by mass of a urethane compound. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009031404(A) 申请公布日期 2009.02.12
申请号 JP20070193219 申请日期 2007.07.25
申请人 ASAHI KASEI ELECTRONICS CO LTD 发明人 AOKI SAYURI;SASAKI TAKAHIRO
分类号 G03F7/004;G03F7/023 主分类号 G03F7/004
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