| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus capable of fully purifying necessary parts of ends of a substrate, and a substrate processing system equipped with the substrate cleaning apparatus. SOLUTION: A cleaning processing unit SD1 is equipped with a spin chuck 521 for rotating a substrate W around a vertical axis passing through a center of the substrate W, while horizontally holding the substrate W. A bevel cleaning portion 530 is arranged in an outward of the spin chuck 521. The bevel cleaning portion 530 is provided with a cleaning brush 531. The cleaning brush 531 has a rotation symmetrical form to a vertical axis, and has an upper bevel cleaning side 531a, an end surface cleaning side 531b and a lower bevel cleaning side 531c. The end surface cleaning side 531b is a cylindrical surface where the vertical direction thereof is set as a shaft center. The upper bevel cleaning side 531a is inclined and prolonged from an upper end of the end surface cleaning side 531b to an outside upper part. The lower bevel cleaning side 531c is inclined and prolonged from a lower end of the end surface cleaning side 531b to an outside lower part. COPYRIGHT: (C)2009,JPO&INPIT
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