| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, in a MAP (mold array package) type sealing process, many unit device regions are divided into a plurality of groups, the divided groups are accommodated in a plurality of cavities having a nearly square planar shape or a shape close to the square for collective sealing, a plurality of mutually independent pots connected to each cavity are used, resulting in quantitative variations of resin tablet which causes a resin filling balance between the plurality of cavities to collapse, and consequently the resin cannot be filled uniformly in all the cavities. SOLUTION: In a MAP type sealing process using a plurality of cavities, a molding die having a linkage for linking the cavities together is used. COPYRIGHT: (C)2009,JPO&INPIT
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