| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for use in semiconductor substrate processing which suppresses the external discharge of such an adhesive scrape, film substrate scrape and semiconductor substrate scrap as generated at the time of cutting in the dicing process, and simultaneously which prevents a semiconductor element from the contamination. SOLUTION: The pressure-sensitive adhesive tape for use in semiconductor substrate processing is the pressure-sensitive adhesive tape for use in semiconductor substrate processing which contains a substrate film, a pressure-sensitive adhesive layer and a release film, and is characterized in that the pressure-sensitive adhesive tape for use in semiconductor substrate processing is provided on the surface of the pressure-sensitive adhesive layer at the substrate film side with a cellular section, and has a length in the thickness direction of the pressure-sensitive adhesive layer in the above cellular section of 5-85% of that of the pressure-sensitive adhesive layer; the manufacturing method of the above pressure-sensitive adhesive tape for use in semiconductor substrate processing and the manufacturing method of a semiconductor device by using the pressure-sensitive adhesive tape for use in semiconductor substrate processing are disclosed at the same time. COPYRIGHT: (C)2009,JPO&INPIT
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