发明名称 Conductive Paste and Wiring Board Using Same
摘要 A conductive paste contains metal powder, an inorganic binder, and an organic vehicle as main ingredients. The organic vehicle includes a solvent having a boiling point of 270° C. or higher, and the proportion of the solvent with respect to the entire solvent included in the organic vehicle is 3 to 100% by weight.
申请公布号 US2009042001(A1) 申请公布日期 2009.02.12
申请号 US20070887844 申请日期 2007.01.18
申请人 YAMAKAWA MASAHIRO;MIYAZAKI KENJI 发明人 YAMAKAWA MASAHIRO;MIYAZAKI KENJI
分类号 H01B1/22;B32B5/00 主分类号 H01B1/22
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