发明名称 |
APPARATUS AND METHOD OF ELECTROLYTIC REMOVAL OF METALS FROM A WAFER SURFACE |
摘要 |
An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.
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申请公布号 |
US2009038960(A1) |
申请公布日期 |
2009.02.12 |
申请号 |
US20070834971 |
申请日期 |
2007.08.07 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DELIGIANNI HARIKLIA;ECONOMIKOS LAERTIS;IVERS CATHERINE;SHAO XIAOYAN |
分类号 |
C25F5/00;B23H3/00;C25F7/00 |
主分类号 |
C25F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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