发明名称 METAL-PLATING COMPOSITION AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a metal-plating composition imparting an improved leveling and a uniform throwing power and a method for the same. SOLUTION: The metal-plating is performed by using the metal-plating composition containing copper, tin, nickel, gold, silver, palladium, platinum, indium, the ion source of these metals and one or more compounds having the following formula (I). H-A'<SB>p</SB>-Q-[C(O)-CH<SB>2</SB>O-((R<SB>1</SB>CH)<SB>t</SB>-O)Z-CH<SB>2</SB>-C(O)-NH-A]<SB>u</SB>-H (I) [wherein, A' is -(NH-(CH<SB>2</SB>)<SB>x'</SB>)<SB>y'</SB>; -NH(CH<SB>2</SB>)<SB>x'</SB>-(O-(CHR<SB>1</SB>)<SB>r'</SB>)<SB>w'</SB>-O-(CH<SB>2</SB>)<SB>x'</SB>-; or -NH-((R<SB>1</SB>CH)<SB>r'</SB>-O)<SB>w'</SB>-C<SB>2</SB>H<SB>4</SB>-, A is -((CH<SB>2</SB>)<SB>x</SB>-NH)<SB>y</SB>-; -(CH<SB>2</SB>)<SB>x</SB>-(O-(CHR<SB>1</SB>)<SB>r</SB>)<SB>w</SB>-O-(CH<SB>2</SB>)<SB>x</SB>-NH-; or -((R<SB>1</SB>CH)<SB>r</SB>-O)<SB>w</SB>-C<SB>2</SB>H<SB>4</SB>-NH-, R<SB>1</SB>is -H or -CH<SB>3</SB>, Q is -NH- when p=1, or -O- when p=0]. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009029776(A) 申请公布日期 2009.02.12
申请号 JP20080095847 申请日期 2008.04.02
申请人 ROHM & HAAS ELECTRONIC MATERIALS LLC 发明人 REDDINGTON ERIK;DESMAISON GONZALO URRUTIA;NIAZIMBETOVA ZUHKRA I;CLEARY DONALD E;LEFEBVRE MARK
分类号 C07C235/70;C25D3/12;C25D3/32;C25D3/38;C25D3/46;C25D3/48;C25D3/50;C25D3/54;C25D3/56 主分类号 C07C235/70
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