发明名称 |
LIGHT SOURCE, MANUFACTURING METHOD OF LIGHT SOURCE, LIGHTING APPARATUS, AND DISPLAY APPARATUS |
摘要 |
Provided is a light source that has high reliability and hardly causes conductivity failure between a light emitting device and a conductive land. In an LED light source of the present invention, an LED bare chip is mounted to conductive lands of a substrate, using bumps (55a, 55b). The LED bare chip (D65) is provided with a p-electrode (Lp) and an n-electrode (Ln) on a rear surface. The p-electrode (Lp) is larger in area than the n-electrode (Ln). The p-electrode (Lp) is bonded to a corresponding conductive land via four bumps (55a), whereas the n-electrode (Ln) is bonded to a corresponding conductive land via one bump (55b). A bonded area (Sn) between the n-electrode (Ln) and the bump (55b) is larger than a bonded area (Sp) between the p-electrode (Lp) and one of the bumps (55a). |
申请公布号 |
US2009039376(A1) |
申请公布日期 |
2009.02.12 |
申请号 |
US20050631583 |
申请日期 |
2005.07.26 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
UEMOTO TAKAARI;NAITO HIROYUKI |
分类号 |
F21V19/00;F21Y101/02;H01L33/48 |
主分类号 |
F21V19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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