ELECTROLYTIC COPPER PLATING PROCESS

摘要

A method for pleating electric copper is provided to minimize a defective attachment and a void cased by an organic product decomposed/degenerated. A method for pleating electric copper comprises the following steps of: setting up electric current density of a plating bath(b) to 5A/L and below; using an adjacent part of dipped metal copper(1) to an oxidative decomposition region; setting up dipped area of the metal copper; and applying air bubbling into the oxidative decomposition region based on the dipped area.