| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the difference in the amount where a resin layer collapses, even if the number of terminals arranged on each of a pair of regions is different. <P>SOLUTION: A semiconductor device includes a plurality of n<SB>1</SB>pieces of first wiring 28 formed from on a plurality of a first electrode 14 to on a first resin layer 20; and a plurality of n<SB>2</SB>(n<SB>2</SB><n<SB>1</SB>) pieces of second wirings 30, formed from on a plurality of a second electrode 16 to on a second resin layer 22. The first and second resin layer 20 and 22 are constituted of the same material and have a shape that longitudinally extends with the same width. The first wiring 28 extends so as to cross a longitudinal axis of the first resin layer 20 and has a first width W<SB>1</SB>on the first resin layer 20; and the second wiring 30 extends so as to cross the longitudinal axis of the second resin layer 22, and has a second width W<SB>2</SB>(W<SB>1</SB><W<SB>2</SB>) on the second resin layer 22. The relation W<SB>1</SB>×n<SB>1</SB>=W<SB>2</SB>×n<SB>2</SB>holds. <P>COPYRIGHT: (C)2009,JPO&INPIT |
